Samsung just announced a new LPDDR5X DRAM chip that is the thinnest in its category. The 12 nm class chips are available in 12 GB and 16 GB packages. It is designed for the low-power RAM market, mostly targeting smartphones with on-device AI capabilities.
The new chip is 0.65 mm thin, making it 9% thinner than its predecessor. The company estimates that will make its cooling 21.2% better.
Samsung created the new chip by optimizing printed circuit board (PCB) and epoxy molding compound techniques, bringing the thickness of the LPDDR5X to the size of a fingernail. It is built in a 4-stack structure, which is four layers packaged together, each consisting of two LPDDR DRAMs.
Samsung is already shipping the new thinner chip to manufacturers. As demand for high-performance, high-density mobile memory solutions grows, the company plans to develop 6-layer 24 GB and 8-layer 32 GB modules into the thinnest packages for future devices.
